Supported Pitch: 0.3, 0.4, 0.45, 0.5, 0.635, 0.65, 0.7, 0.8, 1.0, 1.27, 2.54mm, etc.
Materials: PEI, PES
Configuration: Flip-top, Flip-top with Knob, Double Latch, Push-down
Contact Type: Spring contact
Contact Method: Probe (Pogopin)
Product FeaturesUses self-developed high-quality Pogopin for stable electrical performance.
Replaceable Pogopin allows easy maintenance and low upkeep cost.
Supported Pitch: 0.3, 0.4, 0.45, 0.5, 0.635, 0.65, 0.7, 0.8, 1.0, 1.27, 2.54mm, etc.
Materials: PEI, PES
Configuration: Flip-top, Flip-top with Knob, Double Latch, Push-down
Contact Type: Spring contact, Solder type
Contact Method: Metal spring contacts
Product FeaturesThe company has developed proprietary C‑shaped and S‑shaped spring contacts, integrally stamped with a dual‑contact design, providing stable contact, accurate testing, greater reliability than probes, longer service life, and lower average cost.
Supported Pitch: 0.35, 0.4, 0.5, 0.635, 0.65, 0.8, 1.0, 1.27, 2.54mm, etc.
Material: PEI
Configuration: Flip-top, Flip-top with Knob, Double Latch
Contact Type: Spring contact
Contact Method: Metal spring contacts
Product FeaturesSpring contact design with flip-top mechanism, compact and versatile form factor, compatible with different chip specifications.
Supported Pitch: 0.4, 0.5, 0.635, 0.65, 0.8, 1.0, 1.27, 2.54mm, etc.
Material: PEI
Configuration: Flip-top
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesCompatible with ceramic package chips that have excessive body tolerance, and accommodates varying chip lead/pin lengths.
The external structure of the socket is integrally molded, allowing for a minimized design.
Supported Pitch: 0.35, 0.4, 0.5, 0.65, 0.8, 1.0mm, etc.
Materials: PEI, PES
Configuration: Flip-top, Push-down
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesThe socket is integrally molded for short lead times, stable performance, and longer service life compared to Pogopin‑type sockets, offering excellent durability.
Standard molded sockets support chip body sizes from 3×3mm to 12×12mm (excluding 11×11mm), and chip thicknesses from 0.5mm to 1.2mm (customizable for thicknesses above 1.2mm).
Supported Pitch: 0.4, 0.5, 0.635, 0.65, 0.8, 1.0, 1.27mm, etc.
Materials: PEI, PES
Configuration: Flip-top, Push-down
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesStandard QFP socket, solder‑to‑board design, available in two actuation styles: flip‑top and push‑down.
Spring contacts are stamped from imported special alloys using high‑precision molds, providing reliable contact, high electrical performance, and low impedance.
The socket features a floating plate design that effectively guides and aligns the chip leads/pins.
Supported Pitch: 0.65mm – 8mm; Thickness: 2.5mm – 5.5mm
Material: PEI
Configuration: Flip-top
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesFlip-top design for easy chip insertion and removal.
Supports up to 10A current; customizable for high temperature up to 200°C.
Supported Pitch: 0.5, 0.635, 0.65, 0.8, 1.27mm, etc.
Materials: PEI, PES
Configuration: Push-down
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesPush-down design, compact size, suitable for automated handler operations.
Adopts a dual‑contact clamping structure (top and bottom) with an internal arc greater than 270° for the spring contacts, providing high clamping force and more stable contact.
Supported Pitch: 2.54mm – 5.08mm, 3-pin to 12-pin chips
Materials: PEI, PES
Configuration: Push-down
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesThe overall structure uses a push-down and pull-up mechanism for easy operation and high efficiency.
The metal spring contacts make side‑press contact with the chip leads/pins.
Supported Pitch/Type: DDR3, DDR4 chips
Material: PEI
Contact Type: Spring contact
Contact Method: Metal spring contacts (stamped pins)
Product FeaturesDDR series: Two package sizes, with 35 alignment frames available to accommodate different chip dimensions.
Supported Pitch: 0.3, 0.4, 0.45, 0.5, 0.635, 0.65, 0.7, 0.8, 1.0, 1.27, 2.54mm, etc.
Materials: PEI, PEEK, PES, Aluminum Alloy, PAI
Configuration: Flip-top, Flip-top with Knob, Double Latch, Push-down
Contact Type: Spring Contact, Solder Type
Contact Method: Probe (Pogopin)
Product FeaturesAll components are machined with imported equipment for high precision.
Uses self-developed high-quality Pogopin for stable electrical performance.
Replaceable Pogopin allows easy maintenance and low upkeep cost.
Customizable for all types of chip test sockets available on the market.
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