Supported Chip Types: DDR3, DDR4

Material: PEI

Contact Type: Spring contact

Contact Method: Metal spring contacts (stamped pins)

DDR series: Two package sizes, with 35 alignment frames available to accommodate different chip dimensions.

Supported Pitch: 0.3, 0.4, 0.45, 0.5, 0.635, 0.65, 0.7, 0.8, 1.0, 1.27, 2.54mm, etc.

Materials: PEI, PEEK, PES, Aluminum Alloy, PAI

Configuration: Flip-top, Flip-top with Knob, Double Latch, Push-down

Contact Type: Spring Contact, Solder Type

Contact Method: Probe (Pogopin)

All components are machined with imported equipment for high precision.

Uses self-developed high-quality Pogopin for stable electrical performance.

Replaceable Pogopin allows easy maintenance and low upkeep cost.

Customizable for all types of chip test sockets available on the market.