Supported Pitch: 0.35, 0.4, 0.5, 0.65, 0.8, 1.0mm, etc.
Materials: PEI, PES
Configuration: Flip-top, Push-down
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesThe socket is integrally molded for short lead times, stable performance, and longer service life compared to Pogopin‑type sockets, offering excellent durability.
Standard molded sockets support chip body sizes from 3×3mm to 12×12mm (excluding 11×11mm), and chip thicknesses from 0.5mm to 1.2mm (customizable for thicknesses above 1.2mm).
Supported Pitch: 0.35, 0.4, 0.5, 0.65, 0.8, 1.0mm, etc.
Materials: PEI, PES
Configuration: Flip-top, Push-down
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesThe socket is integrally molded for short lead times, stable performance, and longer service life compared to Pogopin‑type sockets, offering excellent durability.
Standard molded sockets support chip body sizes from 3×3mm to 12×12mm (excluding 11×11mm), and chip thicknesses from 0.5mm to 1.2mm (customizable for thicknesses above 1.2mm).
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