Supported Pitch: 0.4, 0.5, 0.635, 0.65, 0.8, 1.0, 1.27mm, etc.
Materials: PEI, PES
Configuration: Flip-top, Push-down
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesStandard QFP socket, solder‑to‑board design, available in two actuation styles: flip‑top and push‑down.
Spring contacts are stamped from imported special alloys using high‑precision molds, providing reliable contact, high electrical performance, and low impedance.
The socket features a floating plate design that effectively guides and aligns the chip leads/pins.
Supported Pitch: 0.4, 0.5, 0.635, 0.65, 0.8, 1.0, 1.27mm, etc.
Materials: PEI, PES
Configuration: Flip-top, Push-down
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesStandard QFP socket, solder‑to‑board design, available in two actuation styles: flip‑top and push‑down.
Spring contacts are stamped from imported special alloys using high‑precision molds, providing reliable contact, high electrical performance, and low impedance.
The socket features a floating plate design that effectively guides and aligns the chip leads/pins.
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