Supported Pitch: 0.8, 1.0mm, etc.

Materials: PEI, PES

Configuration: Push-down

Contact Type: Solder type

Contact Method: Metal spring contacts

The metal spring contacts use a side‑push structure to contact solder balls, gripping the side walls of the balls. Solder‑to‑board connection method requires no screw fixing.

Push-down design facilitates automatic pick‑and‑place of chips by machinery, and offers lower cost compared to Pogopin‑type sockets.