Supported Pitch: 0.4, 0.5, 0.635, 0.65, 0.8, 1.0, 1.27, 2.54mm, etc.
Material: PEI
Configuration: Flip-top
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesCompatible with ceramic package chips that have excessive body tolerance, and accommodates varying chip lead/pin lengths.
The external structure of the socket is integrally molded, allowing for a minimized design.
Supported Pitch: 0.4, 0.5, 0.635, 0.65, 0.8, 1.0, 1.27, 2.54mm, etc.
Material: PEI
Configuration: Flip-top
Contact Type: Solder type
Contact Method: Metal spring contacts
Product FeaturesCompatible with ceramic package chips that have excessive body tolerance, and accommodates varying chip lead/pin lengths.
The external structure of the socket is integrally molded, allowing for a minimized design.
WeChat
WeChat Account
Chinese
English