Supported Pitch: 0.4, 0.5, 0.635, 0.65, 0.8, 1.0, 1.27, 2.54mm, etc.

Material: PEI

Configuration: Flip-top

Contact Type: Solder type

Contact Method: Metal spring contacts

Compatible with ceramic package chips that have excessive body tolerance, and accommodates varying chip lead/pin lengths.

The external structure of the socket is integrally molded, allowing for a minimized design.