Supported Pitch: 0.4, 0.5, 0.635, 0.65, 0.8, 1.0, 1.27mm, etc.

Materials: PEI, PES

Configuration: Flip-top, Push-down

Contact Type: Solder type

Contact Method: Metal spring contacts

Standard QFP socket, solder‑to‑board design, available in two actuation styles: flip‑top and push‑down.

Spring contacts are stamped from imported special alloys using high‑precision molds, providing reliable contact, high electrical performance, and low impedance.

The socket features a floating plate design that effectively guides and aligns the chip leads/pins.