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Product Specifications
Supported Pitch: 0.3, 0.4, 0.45, 0.5, 0.635, 0.65, 0.7, 0.8, 1.0, 1.27, 2.54mm, etc. Materials: PEI, PEEK, PES, Aluminum Alloy, PAI Configuration: Flip-top, Flip-top with Knob, Double Latch, Push-down Contact Type: Spring Contact, Solder Type Contact Method: Probe (Pogopin) Product FeaturesAll components are machined with imported equipment for high precision. Uses self-developed high-quality Pogopin for stable electrical performance. Replaceable Pogopin allows easy maintenance and low upkeep cost. Customizable for all types of chip test sockets available on the market. |


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